To provide a pattern forming method excellent in roughness performance such as line width roughness and excellent in exposure latitude, and an actinic ray-sensitive or radiation-sensitive resin composition to be used for the method.
The pattern forming method includes steps of: (i) forming a film containing an actinic ray-sensitive or radiation-sensitive resin composition which contains a compound (A) expressed by general formula (I), a resin (P) that shows decrease in the solubility with a developing solution containing an organic solvent by an action of an acid, and a compound (B) that generates an acid by irradiation with actinic rays or radiation; (ii) irradiating the film with actinic rays or radiation; and (iii) developing the film irradiated with actinic rays or radiation by use of a developing solution containing an organic solvent.
SHIBUYA AKINORI
GOTO AKIYOSHI
MATSUDA TOMOKI
FUKUHARA TOSHIAKI
| JP2011022560A | 2011-02-03 |
| WO2008153110A1 | 2008-12-18 |
Takakura Shigeo
Makoto Nakamura
Yoshihiro Fukuhara
Takashi Mine
Toshio Shirane
Nobuhisa Nogawa
Kocho Chojiro
Naoki Kono
Katsu Sunagawa
Morisezo Iseki
Tatsushi Sato
Takashi Okada
Mihoko Horiuchi
Takenori Masanori