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Title:
PATTERN FORMING METHOD, ACTIVE RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2014071304
Kind Code:
A
Abstract:

To provide a pattern forming method which suppresses generation of standing waves, which allows formation of a pattern with high rectangularity while minimizing scum in patterning on a stepped substrate, which can achieve excellent exposure latitude and which is particularly suitable for KrF exposure, and to provide an active ray-sensitive or radiation-sensitive resin composition used for the method, a resist film, a method for manufacturing an electronic device, and an electronic device.

The pattern forming method includes steps of: (1) forming a film by using an active ray-sensitive or radiation-sensitive resin composition comprising a resin (A) having a repeating unit having a group that is decomposed by an action of an acid to generate a polar group and a repeating unit having a carboxyl group, a compound (B) that generates an acid by irradiation with active rays or radiation, and a solvent (C); (2) exposing the film to KrF excimer laser light, extreme ultraviolet rays or an electron beam; and (3) forming a negative pattern by developing the exposed film by using a developing solution containing an organic solvent.


Inventors:
KAMIMURA SATOSHI
TAKAHASHI HIDETOMO
KATO KEITA
Application Number:
JP2012217564A
Publication Date:
April 21, 2014
Filing Date:
September 28, 2012
Export Citation:
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Assignee:
FUJIFILM CORP
International Classes:
G03F7/038; C08F212/14; C08F220/04; C08F220/18; C08F220/26; C08F220/28; C08F220/58; C08F232/00; G03F7/039; H01L21/027
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Other References:
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Attorney, Agent or Firm:
Takeshi Takamatsu
Toshiyuki Ozawa
Hasegawa Hiromichi