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Title:
PATTERN FORMING METHOD, ELECTRON BEAM SENSITIVE OR EXTREME ULTRAVIOLET RAY SENSITIVE RESIN COMPOSITION AND RESIST FILM, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE USING THE SAME
Document Type and Number:
Japanese Patent JP2013080005
Kind Code:
A
Abstract:

To provide a pattern forming method which improves performance in microfabrication of a semiconductor element using an electron beam or extreme ultraviolet ray (EUV ray) and has high sensitivity and is excellent in suppressing occurrence of pattern collapse, and, in addition, has an excellent shape without pattern penetration in a lower part of the pattern, an electron beam sensitive or extreme ultraviolet ray sensitive resin composition, and a resist film, and to provide a method for manufacturing an electronic device and an electronic device using the same.

There is provided a pattern forming method including the steps in the following order of: (1) forming a film using an electron beam sensitive or extreme ultraviolet ray sensitive resin composition including, (A) a resin including acid decomposable repeating units in which a solubility of the resin in a developer having an organic solvent is decreased by an action of an acid, and (B) a low molecular weight compound that generates an acid by irradiation with an electron beam or extreme ultraviolet ray and is decomposed by an action of the acid to decrease a solubility in the organic solvent; (2) exposing the film using an electron beam or extreme ultraviolet ray; and (4) developing the exposed film using a developer including an organic solvent after exposure to form a negative pattern. An electron beam sensitive or extreme ultraviolet ray sensitive resin composition used for the method, and a resist film formed by the method are provided. Further, a method for manufacturing an electronic device and an electronic device using the pattern forming method are also provided.


Inventors:
TSUBAKI HIDEAKI
TAKIZAWA HIROO
KAWABATA KENJI
Application Number:
JP2011000218549
Publication Date:
May 02, 2013
Filing Date:
September 30, 2011
Export Citation:
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Assignee:
FUJIFILM CORP
International Classes:
G03F7/004; C08F220/10; G03F7/038; G03F7/039; G03F7/32; H01L21/027
Domestic Patent References:
JP2011095607A2011-05-12
JP2012027436A2012-02-09
JP2011126871A2011-06-30
JP2010132601A2010-06-17
JP2012220572A2012-11-12
JP2005097254A2005-04-14
JP2005148291A2005-06-09
JP2005326833A2005-11-24
JP2010100604A2010-05-06
JP2010111653A2010-05-20
JP2010134279A2010-06-17
JP2010170094A2010-08-05
JP2011186248A2011-09-22
JP2012203261A2012-10-22
JP2013033230A2013-02-14
JP2013082665A2013-05-09
Attorney, Agent or Firm:
高松 猛
尾澤 俊之
長谷川 博道