PATTERN FORMING METHOD, ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

Title:

PATTERN FORMING METHOD, ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

Document Type and Number:

Japanese Patent JP2014202969

Kind Code:

A

Abstract:

PROBLEM TO BE SOLVED: To provide a pattern forming method for suppressing collapse or peeling of a pattern even when a fine pattern with a high aspect ratio is formed.SOLUTION: The pattern forming method includes: an adhesion assist layer forming step of forming an adhesion assist layer on a substrate, the layer having a polymerizable group and a transmittance of 80% or more to light at a wavelength of 193 nm; a resist film forming step of applying a radiation-sensitive resin composition on the adhesion assist layer to form a resist film; an exposure step of exposing the resist film; and a developing step of developing the exposed resist film to form a pattern.

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Inventors:

TANGO NAOHIRO
ENOMOTO YUICHIRO

Application Number:

JP2013080006A

Publication Date:

October 27, 2014

Filing Date:

April 05, 2013

Export Citation:

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Assignee:

FUJIFILM CORP

International Classes:

G03F7/11; G03F7/038; G03F7/039; G03F7/32; H01L21/027

Attorney, Agent or Firm:

Mochitoshi Watanabe
Haruko Miwa
Hideaki Ito
Mitsuhashi Fumio

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