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Patent Searching and Data


Title:
PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC APPLICATION EQUIPMENT
Document Type and Number:
Japanese Patent JP2006167697
Kind Code:
A
Abstract:

To provide a pattern forming method capable of forming various kinds of patterns with high fineness and high accuracy at a low cost.

A stamp 1 is produced by forming a liquid-repellent pattern 1b on a hydrophilic substrate 1a. After a material 3 having flowability is packed onto the substrate 1a of the stamp 1, the stamp 1 and the other substrate 5 are brought into tight contact with each other. By heating and vaporizing the material 3 in this state, steam 6 is generated within a minute hermetic space surrounded by the stamp 1, the substrate 5, and the pattern 1b. The pattern 7 is formed by allowing the steam 6 to adhere to the surface of the substrate 5. The material 3 having the flowability is a liquid, solution mixture, dispersion liquid, etc.


Inventors:
TANAKA MASANOBU
KAMEI TAKAHIRO
Application Number:
JP2004367911A
Publication Date:
June 29, 2006
Filing Date:
December 20, 2004
Export Citation:
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Assignee:
SONY CORP
International Classes:
B05D3/10; B05D1/18; B05D1/40
Attorney, Agent or Firm:
Koichi Mori