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Patent Searching and Data


Title:
PATTERN FORMING METHOD, MANUFACTURING METHOD OF ELECTROOPTICAL APPARATUS AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2009006295
Kind Code:
A
Abstract:

To form a densified pattern of good quality without bringing about increase in cost.

A pattern is formed by coating a substrate, which has a lyophilic part and a liquid repelling part with respect to a functional liquid, with the functional liquid. This pattern forming method has the first process for selectively coating the substrate P having the lyophilic part Pa with liquid droplets containing a liquid repelling material to form a first liquid repelling part, the second process for coating the lyophilic part with the functional liquid to form a first pattern W1, the third process for applying energy to at least the first liquid repelling part to lower the liquid repellency of the first liquid repelling part, the fourth process for selectively coating the substrate having the lyophilic part and the first liquid repelling part with liquid droplets containing a second liquid repelling material having liquid repellency with respect to a second functional liquid to form a second liquid repelling part H2 and the fifth process for coating the non-forming region of the second liquid repelling part with the second functional liquid to form a second pattern W2 at the layer almost same to the first pattern.


Inventors:
Hirai, Toshimitsu
Application Number:
JP2007000171833
Publication Date:
January 15, 2009
Filing Date:
June 29, 2007
Export Citation:
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Assignee:
SEIKO EPSON CORP
International Classes:
B05D1/26; B05D3/00; G02F1/1368; G09F9/00; H01J9/02; H05K3/10; H05K3/18