PATTERN FORMING METHOD AND PHOTOSENSITIVE COMPOSITION

Title:

PATTERN FORMING METHOD AND PHOTOSENSITIVE COMPOSITION

Document Type and Number:

Japanese Patent JPH07253669

Kind Code:

A

Abstract:

PURPOSE: To stably form a resist pattern with high resolution and excellent durability against dry etching even when a exposure light source of short wavelengths is used, by processing to produce bonds of a first compd. and a second compd. after the second step of the process.

CONSTITUTION: A photosensitive layer containing a photosensitive polymer compd. having high transmittance for light of about 180-220nm wavelength and having no aromatic ring and a low mol.wt. compd. hating aromatic rings is formed and exposed to light. Then the layer is processed to produce chemical bonds of the photosensitive polymer compd. and low mol.wt. compd. to introduce aromatic rings to the polymer compd. Thereby, the photosensitive layer has high transmittance for light of about 180-220nm wavelength during exposure so that enough photochemical reaction proceeds in the whole film. During etching, the photosensitive polymer compd. is bonded with aromatic rings to have high durability against dry etching.

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Inventors:

NAITO TAKUYA
GOKOCHI TORU
ASAKAWA KOUJI
NAKASE MAKOTO

Application Number:

JP4296394A

Publication Date:

October 03, 1995

Filing Date:

March 15, 1994

Export Citation:

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Assignee:

TOSHIBA CORP

International Classes:

G03F7/038; G03F7/039; G03F7/30; G03F7/40; H01L21/027; H01L21/302; H01L21/3065; (IPC1-7): G03F7/039; G03F7/038; G03F7/30; G03F7/40; H01L21/027; H01L21/3065

Attorney, Agent or Firm:

Noriyuki Noriyuki

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