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Title:
PATTERN FORMING METHOD FOR POLYMER INSULATING FILM AND ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2006053452
Kind Code:
A
Abstract:

To provide a pattern forming method for an insulating film by which the insulating film can be simply and easily patterned and which ensures less damage to the constituent elements of a device, and to provide an electronic device.

The pattern forming method for a polymer insulating film comprises: a step of forming a polymer precursor layer 12 by coating the top of a substrate 11 with a polymer insulating film material containing a heat polymerizable polymer precursor material; a step of selectively polymerizing the polymer precursor layer 12 with a heating means; and a step of removing the unpolymerized polymer precursor material with a solvent which does not dissolve the polymer of the polymerized part 13, but dissolves the unpolymerized part 14. The electronic device has a contact hole formed in a polymer insulating film by the method.


Inventors:
TOMONO HIDENORI
KONDO HIROSHI
TANO TAKANORI
KONDO HITOSHI
Application Number:
JP2004236369A
Publication Date:
February 23, 2006
Filing Date:
August 16, 2004
Export Citation:
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Assignee:
RICOH KK
International Classes:
G03F7/004; G03F7/037
Domestic Patent References:
JPS49103639A1974-10-01
JP2000127640A2000-05-09
JPS63142030A1988-06-14
Attorney, Agent or Firm:
Chieko Tateno