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Title:
PATTERN FORMING METHOD AND RESIST COMPOSITION
Document Type and Number:
Japanese Patent JP2012027438
Kind Code:
A
Abstract:

To provide a pattern forming method excellent in sensitivity, limit resolution, roughness properties, exposure latitude (EL), post exposure bake (PEB) temperature dependency and depth of focus (DOF), and a resist composition.

A pattern forming method of the invention comprises: (A) forming a film using a resin-containing resist composition, which includes a repeating unit with a group that is decomposed by an action of an acid to produce an alcoholic hydroxy group and in which its solubility in a developer containing an organic solvent decreases by an action of an acid; (B) exposing the film; and (C) developing the exposed film using a developer containing an organic solvent.


Inventors:
IWATO KAORU
KATAOKA SHOHEI
TARUYA SHINJI
KAMIMURA SATOSHI
KATO KEITA
ENOMOTO YUICHIRO
MIZUTANI KAZUYOSHI
DOBASHI TORU
FUJII KANA
Application Number:
JP2011029622A
Publication Date:
February 09, 2012
Filing Date:
February 15, 2011
Export Citation:
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Assignee:
FUJIFILM CORP
International Classes:
G03F7/038; C08F220/28; C08F232/00; G03F7/039; G03F7/32; H01L21/027
Domestic Patent References:
JP2009258586A2009-11-05
JP2008309879A2008-12-25
JP2008138176A2008-06-19
JPH0950126A1997-02-18
JP2012073565A2012-04-12
JP2011170316A2011-09-01
JP2009258586A2009-11-05
JP2010039145A2010-02-18
JP2009169205A2009-07-30
JP2008290980A2008-12-04
JP2008233613A2008-10-02
Attorney, Agent or Firm:
Kurata Masatoshi
Takakura Shigeo
Satoshi Kono
Makoto Nakamura
Yoshihiro Fukuhara
Takashi Mine
Toshio Shirane
Sadao Muramatsu
Nobuhisa Nogawa
Kocho Chojiro
Naoki Kono
Katsu Sunagawa
Morisezo Iseki
Tatsushi Sato
Takashi Okada
Mihoko Horiuchi
Takenori Masanori



 
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