Title:
PATTERN FORMING METHOD
Document Type and Number:
Japanese Patent JP3353744
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To make eliminable an unnecessary pattern on a photosensitive resin by a simple and easy way and to facilitate the formation of a fine pattern as well as to increase the depth of a focus in pattern transfer.
SOLUTION: The pattern of a photomask is transferred to a chemical amplification type photosensitive resin film and an acid is generated in the photosensitive resin film. A crosslinker-containing resin film 9 is formed on the photosensitive resin film. The photosensitive resin film and the crosslinker-containing resin film 9 are heat-treated to diffuse the acid generated in the photosensitive resin film into the crosslinker-containing resin film. By the diffusion, the crosslinker-containing resin film in the interfacial region between the photosensitive resin and the crosslinker-containing resin film is brought into crosslinking reaction to form a reacted layer 10. The crosslinker-containing resin film 9 is removed while leaving the reacted layer 10. An unnecessary transferred pattern 7 in the pattern transferred to the photosensitive resin is eliminated by the reacted layer.
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Inventors:
Nao Asato
Shinji Ishida
Shinji Ishida
Application Number:
JP17622899A
Publication Date:
December 03, 2002
Filing Date:
June 23, 1999
Export Citation:
Assignee:
NEC
International Classes:
H01L21/027; G03F7/004; G03F7/26; G03F7/38; G03F7/40; (IPC1-7): G03F7/40; G03F7/004; G03F7/26; H01L21/027
Domestic Patent References:
JP1073927A | ||||
JP11119443A | ||||
JP10274854A | ||||
JP495963A | ||||
JP11143047A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)
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