Title:
PATTERN FORMING METHOD
Document Type and Number:
Japanese Patent JPH0354565
Kind Code:
A
Abstract:
PURPOSE: To improve sensitivity to exposure with UV having a prescribed wavelength, resolution and developability by forming a resist layer made of a compsn. contg. a specified alkali-soluble resin.
CONSTITUTION: A resist layer is formed on a substrate by applying and drying a compsn. contg. an alkali-soluble resin obtd. by condensing prescribed phenols with aldehydes and a 1,2-quinonediazido compd. The resist layer is imagewise exposed with light having 300-380 nm wavelength and developed to form a pattern. The phenols are 20-80 mol% m-cresol, 0-50 mol% p-cresol and 20-80 mol% compd. represented by formula I other than m-cresolnd p-cresol. In formu la I, each of R1-R3 is H, hydroxyl, 1-4C alkyl, etc.
Inventors:
MIYASHITA SATOSHI
EBISAWA MASAHIKO
ISAMOTO YOSHITSUGU
MIURA TAKAO
EBISAWA MASAHIKO
ISAMOTO YOSHITSUGU
MIURA TAKAO
Application Number:
JP19106789A
Publication Date:
March 08, 1991
Filing Date:
July 24, 1989
Export Citation:
Assignee:
JAPAN SYNTHETIC RUBBER CO LTD
International Classes:
G03F7/023; C08L61/04; C08L61/06; H01L21/027; (IPC1-7): C08L61/06; G03F7/023; H01L21/027
Domestic Patent References:
| JPS60164740A | 1985-08-27 | |||
| JPS60176034A | 1985-09-10 | |||
| JPS62227144A | 1987-10-06 | |||
| JPS60158440A | 1985-08-19 | |||
| JPH0210352A | 1990-01-16 |
Attorney, Agent or Firm:
Masataka Oshima
Next Patent: JPH0354566