PURPOSE: To enhance the film thickness controllability and operation environment and to facilitate the pattern formation by forming a resist polyurea film on a substrate by the vapor deposition polymerization process.
CONSTITUTION: The inside of a processing chamber 1 is connected with an external vacuum pump or the like vacuum line 2 and the substrate 3 for forming the vapor deposition polyurea film in the chamber 1, and the thickness of the film formed on the substrate 3 is measured by a film thickness monitor 5 set in front of the substrate 3. The photoreceptor film of polyurea in a low molecular weight is formed by evaporating ≥2 kinds of monomers, diamine and diisocyanate, as starting materials in vacuum and depositing and polymerizing them on the substrate 3, and the pattern is formed by irradiating this polyurea film with ultraviolet rays through a pattern forming mask to make it to have high-molecular weight and removing the polyurea on the nonirradiated parts.
IIJIMA MASAYUKI
UKISHIMA YOSHIYUKI
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