PURPOSE: To provide a pattern forming method notably simplifying the facilities resultant form the simplification of the forming step and formation by a method wherein the circuit pattern including the interlayer connection is selectively and directly formed on a substrate.

CONSTITUTION: Within the pattern forming method to form a printed circuit on a substrate, a setting resin ink set by irradiation with heat and ultraviolet rays in this invention is used to be turned into fine particles from a nozzle of a writing-in head for jetting the particles over a printed-wiring board so that the patterns including circuit, letter codes, through hole, etc., may be drawn to be set directly on the substrate by shifting the writing-in head in the quadratic direction (X-Y direction) with the printed-circuit board opposite to said head.