PURPOSE: To decrease the number of processes by applying a photosensitive resin onto the surface of an object to be worked, exposing and developing a part of the applied part, and thereafter, exposing and developing the unexposed part, and thereafter, etching the object to be worked.
CONSTITUTION: A positive type photoresist is supplied onto the surface of an object to be worked, and thereafter, only an alignment mark forming part 3 is exposed by a desired mark pattern, and subsequently, developed by a developer, and an alignment mark 4 of a photoresist is formed on the surface of an object to be worked 1. Subsequently, based on this alignment mark 4 as a reference, a part of 5 of the unexposed part is exposed by a desired pattern, next, the object to be worked 1 is moved, and based on the alignment mark 4 as a reference, the remaining unexposed part 6 is exposed by a desired pattern. Subsequently, a development and an etching are executed, the photoresist is peeled off, and a long-sized pattern 7 is formed. In such a way, washing of a substrate, applying the photoresist, etching and peeling of the photoresist are executed only once, and the process is shortened, therefore, the yield is improved.
TERADA KATSUNORI
MASAKI YUICHI
MORIMOTO KENJI
