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Title:
PATTERN MEASUREMENT METHOD, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING IT, PROGRAM AND COMPUTER-READABLE STORAGE MEDIUM, AND PATTERN MEASURING DEVICE
Document Type and Number:
Japanese Patent JP3699949
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a device, a method, and the like for quickly and accurately measuring a pattern.
SOLUTION: Graphic data of a plurality of patterns HP2 and HP4 including image data are obtained and processed to detect coordinates of outline points of the patterns HP2 and HP4. The outline points pair are combined between the respective patterns, a distance between the outline points constituting each outline point pair and an angle between a straight line connecting the outline points together and an optional axial line are computed for each outline point pair, a DAD diagram serving as a distribution diagram of the distance and the angle of the computed outline point pairs is formed, and characteristic points A, B, B', C, D and D' of the DAD diagram are extracted. On the basis of these characteristic points, at least one of a shape relationship, a size relationship, and a relative position relationship between the patterns HP2 and HP4 is evaluated.


Inventors:
Tadashi Mitsui
Application Number:
JP2002281572A
Publication Date:
September 28, 2005
Filing Date:
September 26, 2002
Export Citation:
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Assignee:
Toshiba Corporation
International Classes:
G01B11/24; G06T1/00; G06T7/00; G06T7/60; G06V10/46; G01B11/00; H01L21/66; (IPC1-7): G01B11/24; G06T1/00; G06T7/00; G06T7/60; H01L21/66
Domestic Patent References:
JP2000268270A
JP7311849A
JP4184575A
JP3127185A
Attorney, Agent or Firm:
Kenji Yoshitake
Hidetoshi Tachibana
Yasukazu Sato
Hiroshi Yoshimoto
Yasushi Kawasaki
Hakozaki Yukio