Title:
パターニングプロセス制御方法、デバイス製造方法
Document Type and Number:
Japanese Patent JP6968982
Kind Code:
B2
Abstract:
Methods of controlling a patterning process are disclosed. In one arrangement, tilt data resulting from a measurement of tilt in an etching path through a target layer of a structure on a substrate is obtained. The tilt represents a deviation in a direction of the etching path from a perpendicular to the plane of the target layer. The tilt data is used to control a patterning process used to form a pattern in a further layer.
Inventors:
Van Dongen, Jeroen
McNamara, Elliott, Gerald
Hinnen, Paul, Kristian
Jochemsen, Marinus
McNamara, Elliott, Gerald
Hinnen, Paul, Kristian
Jochemsen, Marinus
Application Number:
JP2020510516A
Publication Date:
November 24, 2021
Filing Date:
August 08, 2018
Export Citation:
Assignee:
AS M Netherlands B.V.
International Classes:
G03F7/20; G01B11/26; G03F9/00
Domestic Patent References:
| JP2015201552A | ||||
| JP2004510152A | ||||
| JP2000303193A | ||||
| JP2017526973A |
Foreign References:
| US20080215276 | ||||
| WO2015124391A1 | ||||
| US20130308142 | ||||
| WO2017102304A1 | ||||
| KR1020080029609A |
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
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