Title:
PEELING DEVICE OF CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2017168563
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To prevent one circuit board to be cracked when one circuit board of two laminated circuit boards is peeled from the other circuit board.SOLUTION: A peeling device 1 of a circuit board is constructed so that each line of a suction pad group 7 (first line L1 to a third line L3) sucks a supporting glass circuit board 3 by a suction pad 6, and is moved to an upper direction separating from the glass circuit board 2 sequentially to a rear line side from a front line side, thereby gradually peeling a not-peeled part 3a of the supporting glass circuit board 3 along a peeling direction P from the glass circuit board 2. In accordance with the movement from an initial position SH of a movable body 5 holding the suction pad group 7, the suction pad 6 is arranged in a position of the second and subsequent lines from the beginning (the second line L2 and the third line L3) is constructed so as to be extended to the upper direction corresponding to a movement distance of the movable body 5, and an extendable stroke becomes longer at the suction pad 6 to be set at more rear line.SELECTED DRAWING: Figure 4
Inventors:
OKA TAKAO
FUJITA TAKASHI
AIBA HISATOSHI
FUJITA TAKASHI
AIBA HISATOSHI
Application Number:
JP2016050892A
Publication Date:
September 21, 2017
Filing Date:
March 15, 2016
Export Citation:
Assignee:
NIPPON ELECTRIC GLASS CO
International Classes:
H01L21/683; B25J15/06
Attorney, Agent or Firm:
Kunihiko Shiromura
Tsuyoshi Kumano
Shinichi Tomohiro
Tsuyoshi Kumano
Shinichi Tomohiro