Title:
剥離装置
Document Type and Number:
Japanese Patent JP7195051
Kind Code:
B2
Abstract:
The present invention is to shorten the time for obtaining the position information of the semiconductor wafer W. The present invention provides a stripping apparatus 1 including an area camera 80 capable of photographing a first wide scope in a range of a thin plate S on which a plurality of semiconductor wafers W are attached, a support moving means 21 that moves the thin plate supporter 2 holding the thin plate S relative to the area camera 80, a stripping means 3 that strips off the semiconductor wafer W according to the position information of the semiconductor wafer W photographed by the area camera 80, and a line scan camera 70 capable of photographing a second wide scope that is wider than the first wide scope in a range of a thin plate S, wherein the support moving means 21 moves the thin plate support 2 holding the thin plate S relative to the area camera 80 according to the existence information of the semiconductor W wafer on the thin plate S photographed by the line scan camera 70.
Inventors:
Ishii Susumu
Ryoji Shimada
Ryoji Shimada
Application Number:
JP2018027593A
Publication Date:
December 23, 2022
Filing Date:
February 20, 2018
Export Citation:
Assignee:
YAC Garter Co., Ltd.
International Classes:
H01L21/67
Domestic Patent References:
| JP63087832U | ||||
| JP2001217302A | ||||
| JP2000012571A | ||||
| JP2015159294A | ||||
| JP2016143832A | ||||
| JP2008125059A | ||||
| JP20161768A |
Foreign References:
| WO2017130361A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation Haruka International Patent Office