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Patent Searching and Data


Title:
接着部の剥離検査方法
Document Type and Number:
Japanese Patent JP4027258
Kind Code:
B2
Abstract:
A bond separation inspection method using an optical fiber sensor. The method includes a step of embedding a sensor part of an optical fiber sensor in an adhesive joining a plurality of members together. The sensor part is embedded in the adhesive in such a way that the sensor part undergoes a compressive strain. Separation of the bond is detected on the basis of an optical characteristic of the sensor part when light from a light source is directed into the optical fiber sensor.

Inventors:
Keiichi Sato
Kazuyama Kageyama
Application Number:
JP2003114786A
Publication Date:
December 26, 2007
Filing Date:
April 18, 2003
Export Citation:
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Assignee:
Honda motor industry stock company
International Classes:
G01D5/353; G01J1/02; B29C65/82; G01J3/18; G01L1/24; G01M5/00; G01M11/00; G01N21/88; G01N21/954
Domestic Patent References:
JP2000501176A
JP2001021384A
Attorney, Agent or Firm:
Yoichiro Shimoda
Tamiya Hiroshi