To provide a peeling method enabling easy peeling, and to improve a manufacturing yield of a device by improving peeling accuracy.
The method peels a multilayer substrate (S) having a first substrate (S1) with a peeling layer (3) and a semiconductor element (55) formed thereon and a second semiconductor substrate (S2) joined to the semiconductor element formation surface of the first substrate via a bonding layer (18). The method peels the first substrate and the second substrate from the inside or interface of the peeling layer (3) of the multilayer substrate under a negative pressure. According to this method, the first substrate and the second substrate are peeled under a negative pressure to enlarge the gap in the inside or interface of the peeling layer, so that peeling can be facilitated.
Katsuro Tanaka
Shinji Oga
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