To provide a peeling method and a peeling device for an insulating layer of a conductive wire capable of peeling only a coated part without shaving a conductive part of the cable.

The device comprises a nozzle 2b of a guide member movably guiding the conductive wire (wire material) A to the axial direction, a rotating member 2 rotating about the conductive wire A at the external periphery of the guide member 2b, a cutter 4 that is disposed at the rotating member 2 and detachable to the conductive wire A, an eccentric weight 6 press-pushing the cutter 4 to the side of the conductive wire A by a centrifugal force associated with a rotation, a spring 8 for increasing the force of the cutter 4 to the direction that separates from the conductive wire A so as to counterwork with the centrifugal force and a driving unit (motor) 3 for driving the rotating member 2 having the variable number of revolutions. When the motor 3 rotates, the balancing position that balances the centrifugal force applied to the weight 6 and the spring 8 is varied with the rotational speed of the motor, and the position of a rotating blade 4a of the cutter 4 is regulated by changing the number of revolutions of the motor 3 corresponding to the diameter of the wire material A.