Title:
PEELING SHEET AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH06218881
Kind Code:
A
Abstract:
PURPOSE: To provide peeling sheet, which has favorable adhesion to board and, at the same time, is excellent in peeling properties, and its manufacturing method.
CONSTITUTION: On board, peeling layer consisting of electron beam curing resin and ultraviolet curing silicone resin is provided. In the peeling sheet, the nearer the peeling layer comes to the board, the more the elevtron beam curing resin component is so constituted as to be in the peeling layer. Thus, the peeling properties of the peeling sheet is favorable and the adhesion between the board and the peeling sheet is good, resulting in occurring no rubbing-off.
Inventors:
HARADA JUNJI
Application Number:
JP1279993A
Publication Date:
August 09, 1994
Filing Date:
January 28, 1993
Export Citation:
Assignee:
MITSUBISHI PAPER MILLS LTD
International Classes:
B05D3/06; B05D7/24; B32B27/00; B32B27/10; (IPC1-7): B32B27/00; B05D3/06; B05D7/24; B32B27/10