Title:
ADHESIVE BOOKBINDING DEVICE
Document Type and Number:
Japanese Patent JP2016120596
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an adhesive bookbinding device which sucks and removes chips scattering from upper and lower parts of a milling cutter and a gap between guide plates.SOLUTION: In a cutting mechanism, two guide plates 31, 32, which are movable so as to set a gap in a predetermined width according to a width of a back 3 of a booklet content 2, are provided in a planar shape. A rotary milling cutter 41 for cutting the back 3 and a motor 42 for rotating the milling cutter 41 are covered with a body 50 on the side of the lower surfaces of the guide plates 31, 32. The body 50 is provided with an exhaust hole 51 for exhaust connected to a dust collector, and an air hole 52 for taking in outside air. A suction port 61 of a suction duct 60 for sucking chips leaked from a gap between the guide plates 31, 32 is arranged toward the gap between the guide plates 31, 32. This prevents the chips from scattering, thereby solving the above mentioned problem.SELECTED DRAWING: Figure 2
Inventors:
NAGAOKA TAKUYA
Application Number:
JP2014259969A
Publication Date:
July 07, 2016
Filing Date:
December 24, 2014
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
B42C5/00; B42C11/04; B65H37/04
Attorney, Agent or Firm:
Hiromi Fujimasu
Keiko Fukamachi
Hideo Ito
Naoki Goto
Yusuke Ito
Hideyuki Tateishi
Keiko Fukamachi
Hideo Ito
Naoki Goto
Yusuke Ito
Hideyuki Tateishi