To provide a phenol resin composition generating no harmful gas upon curing, excellent in production stability, and further excellent in curability and strength.

The phenol resin composition includes a resol-type phenolic resin and novolac-type resorcinol resin as essential components, wherein the amount of dimethylene ether group in the resol-type phenolic resin is 20-80 mol.% based on the total binding groups derived from aldehydes which binds aromatic rings derived from phenols. The novolac-type resorcinol resin is preferably 1-50 wt.% based on the total phenolic resin composition.