To provide a phenolic resin composed of a novel polyhydric phenolic compound which gives an epoxy resin cured product having excellent low hygroscopicity and low stress, and its preparation method.
The phenolic resin is composed of a polyhydric phenolic compound to be represented by formula (1) [wherein R1 is a group to be selected from an alkyl group, an alkoxy group, a halogen, or a phenyl group or an aralkyl group which is nonsubstituted or substituted; the entire Z or part of Z is a group to be represented by formula (2) (wherein R2 is a group to be selected from an alkyl group, an alkoxy group, a halogen, or a phenyl group or an aralkyl group which is nonsubstituted or substituted; b is an integer of 0-5); n is an average of numbers of 0-8; and a is an integer of 0-4], and the balance is a direct bond or an alkylene group.
HAYAKAWA ATSUTO
ITO AKIHIRO
