Title:
PHENOLIC RESIN MOLDING MATERIAL
Document Type and Number:
Japanese Patent JP2000226495
Kind Code:
A
Abstract:
To provide a phenolic resin molding material which has high mechanical strengths, good electrical insulating properties and excellent sliding characteristics.
The phenolic resin molding material comprises, as essential ingredients, a high-molecular phenolic novolak resin having a number average molecular weight of 1,000-1,500, a fine powder of a polytetrafluoroethylene resin and a polyimide powder, and contains 5-40 wt.% of the fine powder of a polytetrafluoroethylene resin and 1-5 wt.% of the polyimide powder based on the whole molding material.
Inventors:
AKIMOTO HIROSHI
ASAMI KENJI
NAKAJIMA YUKINORI
ASAMI KENJI
NAKAJIMA YUKINORI
Application Number:
JP2954499A
Publication Date:
August 15, 2000
Filing Date:
February 08, 1999
Export Citation:
Assignee:
TOSHIBA CHEM CORP
International Classes:
C08L61/08; (IPC1-7): C08L61/08
Attorney, Agent or Firm:
Eiji Morota
Previous Patent: JP2000226493
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