Title:
PHENOLIC RESIN MOLDING MATERIAL
Document Type and Number:
Japanese Patent JP2002265752
Kind Code:
A
Abstract:
To obtain a phenolic resin molding material which excels in abrasion resistance without damaging the heat resistance and dimension stability of a phenolic resin molding material having glass fibers as the major base material.
The phenolic resin molding material comprises, based on the entire molding material, 17-35 wt.% phenolic resin, 10-30 wt.% glass fibers, 30-70 wt.% inorganic substance having a Mohs hardness of ≥6.5, and 1-5 wt.% lubricating thermoplastic resin as the lubricant.
Inventors:
ODA HIROTO
TOMITA KYOICHI
NANAUMI KEN
TOMITA KYOICHI
NANAUMI KEN
Application Number:
JP2001074277A
Publication Date:
September 18, 2002
Filing Date:
March 15, 2001
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08L61/06; C08K3/00; C08K7/14; (IPC1-7): C08L61/06; C08K3/00; C08K7/14
Attorney, Agent or Firm:
Hajime Tsukuni (3 outside)