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Title:
PHENOLIC RESIN MOLDING MATERIAL
Document Type and Number:
Japanese Patent JP2005247941
Kind Code:
A
Abstract:

To provide a phenolic resin molding material which hardly generates mold flashes on molding, is excellent in thermal stability and flowability and gives a molded article exhibiting good external appearances after moistened.

The phenolic resin molding material comprises (a) a phenolic resin, (b) a crushed powder of a thermosetting resin cured product, (c) a crushed powder of date husk and (d) an inorganic filler, where the components (b)-(d) have a grain size distribution below: (b) at least 90 wt% of the whole fall within 1-100 μm and at least 30 wt% of the whole fall within 30-70 μm; (c) at least 90 wt% of the whole fall within 1-120 μm and at least 30 wt% of the whole fall within 40-80 μm; and (d) at least 90 wt% of the whole fall within 1-20 μm and at least 30 wt% of the whole fall within 5-15 μm.


Inventors:
YUASA MICHIYUKI
Application Number:
JP2004058371A
Publication Date:
September 15, 2005
Filing Date:
March 03, 2004
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08L61/10; C08K3/00; C08L97/02; C08L101/00; (IPC1-7): C08L61/10; C08K3/00; C08L97/02; C08L101/00