Title:
PHENOLIC RESIN MOLDING MATERIAL
Document Type and Number:
Japanese Patent JP3543924
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a phenolic resin molding material which is excellent in tracking resistance, dielectric strength, flame resistancy, bending strength and impact strength.
SOLUTION: This phenolic resin molding material which contains 25-35 wt.% of a resol type phenolic resin and at least 40 wt.% of an inorganic filler which releases water of crystallization at a temperature of at least 200°C, as a flame retardant component, and therein at least one inorganic filler which releases at least 20 wt.% of water of crystallization at a temperature of at least 200°C, contains at least 10 wt.% of the latter inorganic filler, further 5-15 wt.% of a glass fiber, and 2-5 wt.% of polyvinyl butyral.
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Inventors:
Shinichi Maebu
Application Number:
JP23878198A
Publication Date:
July 21, 2004
Filing Date:
August 25, 1998
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08K3/00; C08K7/14; C08K13/04; C08L61/06; (IPC1-7): C08L61/06; C08K13/04
Domestic Patent References:
| JP56092927A | ||||
| JP4224857A | ||||
| JP60223853A | ||||
| JP9169887A | ||||
| JP9143342A | ||||
| JP10182936A |
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