Title:
PHENOLIC RESIN MOLDING MATERIAL
Document Type and Number:
Japanese Patent JPS57180651
Kind Code:
A
Abstract:
PURPOSE: To provide the titled molding material having improved thermal stability, curing characteristics and other characteristics, by incorporating glass fiber and hydrated aluminum magnesium silicate as inorg. fillers in a phenolic resin.
CONSTITUTION: Glass fiber and hydrated aluminum magnesium silicate as inorg. fillers are incorporated in a phenolic resin. As said hydrated silicate, fibrous or needle silicate having a large particle size is preferred. When the surface of the silicate is treated with a silane coupling agent, the miscibility of the silicate with the phenolic resin is improved and hence the mechanical strength can also be improved.
Inventors:
OOTSU MASAAKI
KOTANI YOSHIO
SATOU TADASHI
KOTANI YOSHIO
SATOU TADASHI
Application Number:
JP6744481A
Publication Date:
November 06, 1982
Filing Date:
April 30, 1981
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
C08L61/00; C08K3/34; C08K7/14; C08L61/04; C08L61/06; (IPC1-7): C08K3/34; C08K7/14; C08L61/06