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Title:
PHOSPHORUS-CONTAINING COPPER ANODE FOR ELECTRIC COPPER PLATING AND ELECTRIC COPPER PLATING METHOD USING THE SAME
Document Type and Number:
Japanese Patent JP2012149323
Kind Code:
A
Abstract:

To provide a phosphorus-containing copper anode for electric copper plating, with which production of anode slime is suppressed and production of plating defects such as contamination or projections on the surface of a material to be plated such as a semiconductor wafer is prevented even when fine copper wiring is formed on the semiconductor wafer or the like.

In the phosphorus-containing copper anode for electric copper plating, the content of Zr is 15-50 ppm by weight, the content of phosphorus is 100-800 ppm by weight, and the balance comprises copper and inevitable impurities.


Inventors:
NAKAYA KIYOTAKA
KITA KOICHI
KUMAGAI TSUTOMU
KATO NAOKI
WATANABE MAMI
Application Number:
JP2011010347A
Publication Date:
August 09, 2012
Filing Date:
January 21, 2011
Export Citation:
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Assignee:
MITSUBISHI MATERIALS CORP
International Classes:
C25D17/10; C25D3/38
Domestic Patent References:
JP2011152875A2011-08-11
JP2012144797A2012-08-02
JP2003129295A2003-05-08
JP2003268595A2003-09-25
JP2003171797A2003-06-20
JP2012122114A2012-06-28
JP2003529206A2003-09-30
JP2011152875A2011-08-11
JP2012144797A2012-08-02
JP2003129295A2003-05-08
JP2003268595A2003-09-25
JP2003171797A2003-06-20
JP2012122114A2012-06-28
JP2003529206A2003-09-30
Attorney, Agent or Firm:
Kageyama Shuichi
Kazuo Tomita
Masayuki Miyake



 
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