Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
光硬化型導体インキ及び電極パターンの形成方法
Document Type and Number:
Japanese Patent JP4530390
Kind Code:
B2
More Like This:
JP3675285PRODUCTION OF ANISOTROPIC CONDUCTIVE ADHESIVE FOR FLIP- CHIP BONDING OF PLASTIC SUBSTRATE
JP2012230866CONDUCTIVE PASTE
JPS5999471[Title of the device] Copper paste containing solder powder
Inventors:
Satoshi Shioda
Toshihiko Takeda
Application Number:
JP2001065719A
Publication Date:
August 25, 2010
Filing Date:
March 08, 2001
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
H01B1/22; C09D11/02; C09D11/033; C09D11/52; H01B1/00; H01B13/00; H01J9/02; H01J11/22; H01J11/34
Domestic Patent References:
JP11246638A
JP2001234106A
Attorney, Agent or Firm:
Yoshihiko Mitsurai



 
Previous Patent: JPS4530389

Next Patent: 建設排泥土の処理方法及び建設排泥土を充填した土留壁