Title:
PHOTO-CURABLE RESIN COMPOSITION AND ITS USE
Document Type and Number:
Japanese Patent JP2002302532
Kind Code:
A
Abstract:
To provide a photo-curable resin composition capable of obtaining a cured material excellent in heat resistance and flexibility.
This photo-curable resin composition contains [I] a block copolymer obtained by copolymerizing a polymer component (B) having ≥10°C glass transition point and 500-150,000 number-average molecular weight at both terminals or one side terminal of (A) a polymer component having ≤0°C glass transition point and 100-200,000 number-average molecular weight in a block state and also containing glycidyl group at its terminal and/or side chain, and [II] a cationic photo polymerization catalyst.
Inventors:
UEDA MITSUNORI
MATSUNAMI HITOSHI
KUROSE TETSUO
MATSUNAMI HITOSHI
KUROSE TETSUO
Application Number:
JP2001104149A
Publication Date:
October 18, 2002
Filing Date:
April 03, 2001
Export Citation:
Assignee:
NIPPON SYNTHETIC CHEM IND
International Classes:
C08F293/00; C08G59/34; C09D5/00; C09D153/00; C09D163/00; C09J153/00; C09J163/00; (IPC1-7): C08G59/34; C08F293/00; C09D5/00; C09D153/00; C09D163/00; C09J153/00; C09J163/00
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