PURPOSE: A composition for prepregs which is stable for a long time and forms a cured product having excellent properties, prepared by blending an epoxy resin modified with a polyvinyl formal or phenoxy resin, with an organic solvent and a compound which, when irradiated with light, forms a Lewis acid.
CONSTITUTION: There are blended a modified epoxy resin prepared by reacting 90W60pts.wt. epoxy resin having at least two epoxy groups in the molecule, with 10W40pts.wt. polyvinyl formal or phenoxy resin or a mixture thereof at 150W230°C; an organic solvent; and a compound which, when irradiated with light, forms a Lewis acid. As the organic solvent, there is preferably used a mixed solvent consisting of 80W60pts.wt. aromatic hydrocarbon and 20W40pts.wt. aliphatic alcohol. As the compounds which, when irradiated with light, form a Lewis acid, there are preferably used onium salts of Lewis acids. As such onium salts, there can be mentioned salts between a cation such as an aromatic iodinium cation and an anion such as BF4- or PF6-.
| JPS6333472 | THERMOSETTING RESIN COMPOSITION |
SATOU SADAO
SUZUKI YASUHIRO
| JPS5284248A | 1977-07-13 | |||
| JPS50158698A | 1975-12-22 |