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Title:
PHOTO-SETTING RESIN, AND RESIN COMPOSITION AND COATING MATERIAL CONTAINING THE RESIN
Document Type and Number:
Japanese Patent JP2004010772
Kind Code:
A
Abstract:

To provide a low-cost high-molecular-weight photo-setting resin excellent in hardness, marring resistance and solvent resistance, while maintaining adherence and the like, and provide a resin composition containing the photo-setting resin, and a coating material containing the composition.

The photo-setting resin is obtained by copolymerizing an unsaturated compound having one glycidyl group and one polymerizable unsaturated bond with an unsaturated compound having one polymerizable unsaturated bond to give a copolymer (I), subjecting the copolymer (I) to addition reaction with an unsaturated compound having one carboxy group and one polymerizable unsaturated bond to give an acrylic photo-setting resin (II), and reacting the resin (II) with an isocyanate containing a photo-functional group.


Inventors:
SUGAWARA ATSUSHI
HAMADA KEIJI
KONDO SHUICHI
SUZUKI HIROSHI
Application Number:
JP2002166915A
Publication Date:
January 15, 2004
Filing Date:
June 07, 2002
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08F8/30; C09D4/00; C09D133/00; C08F290/04; (IPC1-7): C08F8/30; C08F290/04; C09D4/00; C09D133/00
Attorney, Agent or Firm:
Hidekazu Miyoshi
Yasuo Miyoshi
Iwa Saki Kokuni
Akira Kurihara
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu