Title:
PHOTO- AND THERMO-SETTING RESIN COMPOSITION AND PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2015121775
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a photo- and thermo-setting resin composition that can give a cured film excellent in both flexibility and thermal shock resistance without decreasing such characteristics as solder heat resistance, thermal degradation resistance, and acid resistance, and to provide a printed wiring board having a solder resist film (cured film) formed by using the above composition.SOLUTION: An alkali-developable photo- and thermo-setting resin composition comprises a glycoluril compound represented by chemical formula (I), a photosensitive prepolymer having two or more unsaturated double bonds in one molecule, and a photopolymerization initiator. In the formula, Rto Rare same or different from one another, and each represents a hydrogen atom or a glycidyl group.
Inventors:
MIZOBE NOBORU
Application Number:
JP2014218061A
Publication Date:
July 02, 2015
Filing Date:
October 27, 2014
Export Citation:
Assignee:
SHIKOKU CHEM
International Classes:
G03F7/004; C08F290/06; C08G59/20; G03F7/027; G03F7/035; H05K3/28
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