Title:
PHOTOCOUPLING SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS55163883
Kind Code:
A
Abstract:
PURPOSE:To improve the insulating strength of a transparent insulating resin in a photocoupling semiconductor device without lowering the photocoupling sensitivity by providing an intermediate layer with opaque insulating resin having large adhering strength with the transparent insulating resin therein. CONSTITUTION:There are coated opaque insulating resin becoming no surface electrically in the boundary with a transparent insulating resin layer 7 on the surface of the layer 7 as well as on the input side external lead conductors 2a, 2b, output side external lead conductors 5a, 5b, input side internal lead wire 3 and output side internal lead wire 6 on the required surface to form an intermediate opaque insulating resin layer 9 thereon.
Inventors:
KITABI SHIGERU
Application Number:
JP7291779A
Publication Date:
December 20, 1980
Filing Date:
June 07, 1979
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L23/29; H01L23/31; H01L31/12; H01L31/16; H01L33/54; H01L33/56; (IPC1-7): H01L23/30; H01L31/00; H01L31/12
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