Title:
PHOTOCURABLE ADHESIVE
Document Type and Number:
Japanese Patent JP2015221853
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a photocurable adhesive that is curable by a direct laser beam irradiation while causing little carbonization of a surface of the photocurable adhesive, and is sufficiently curable even when a coating thickness is increased.SOLUTION: A photocurable adhesive 1 is curable by laser beam irradiation. The curable adhesive 1 contains an epoxy-based adhesive component 11, a photoabsorption component 12 that thermally cures the epoxy-based adhesive component 11 by absorption of the laser beam, and an inorganic filler 13. A content of the photoabsorption component 12 is 0.1 mass% or less. Thermal conductivity before the photocurable adhesive 1 is cured is 0.2 W/m K or more, and thermal conductivity after being cured is 0.5 W/m K or more.
Inventors:
KOGA KENJI
TAKAMA DAISUKE
OGAWA AKIRA
YAMADA SHINSUKE
MATSUDA TAKUYA
TAKAMA DAISUKE
OGAWA AKIRA
YAMADA SHINSUKE
MATSUDA TAKUYA
Application Number:
JP2014106326A
Publication Date:
December 10, 2015
Filing Date:
May 22, 2014
Export Citation:
Assignee:
DENSO CORP
ADEKA CORP
ADEKA CORP
International Classes:
C09J163/00; C09J11/04
Domestic Patent References:
| JP2006249260A | 2006-09-21 | |||
| JP2010180352A | 2010-08-19 | |||
| JP2007231088A | 2007-09-13 | |||
| JP2009155402A | 2009-07-16 | |||
| JP2012184322A | 2012-09-27 | |||
| JP2008266434A | 2008-11-06 | |||
| JP2012158653A | 2012-08-23 | |||
| JP2014005372A | 2014-01-16 |
Attorney, Agent or Firm:
Patent Business Corporation Aichi International Patent Office
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