Title:
光硬化性組成物及びパターン形成方法
Document Type and Number:
Japanese Patent JP7175092
Kind Code:
B2
Abstract:
To provide: a photocurable composition that is excellent in any of a mold release property between a mold and a resin-cured film and an adhesion between a substrate and the resin-cured film in addition to a coatability to the substrate; and a pattern forming method using the same.SOLUTION: Provided is a photocurable composition containing: component (P): a phosphate ester having a polymerizable functional group; component (A): a photopolymerizable compound having three or more polymerizable functional groups (excluding the component (P)); component (B): a photopolymerizable monomer having one or two polymerizable functional groups (excluding the component (P)); and component (C): a photopolymerization initiator, in which the surface tension is 25 to 35 mN/m.SELECTED DRAWING: None
Inventors:
Kenri Kunno
Application Number:
JP2018049966A
Publication Date:
November 18, 2022
Filing Date:
March 16, 2018
Export Citation:
Assignee:
Tokyo Ohka Kogyo Co., Ltd.
International Classes:
C08F220/26; B29C59/02; C08F290/06; H01L21/027
Domestic Patent References:
| JP2012134446A | ||||
| JP2010254795A | ||||
| JP2015185798A | ||||
| JP2017135413A | ||||
| JP2016207685A | ||||
| JP2018031940A |
Foreign References:
| WO2017195586A1 |
Attorney, Agent or Firm:
Sumio Tanai
Masahisa Matsumoto
Ryu Miyamoto
Masato Iida
Masahisa Matsumoto
Ryu Miyamoto
Masato Iida
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