To provide a heat-resistant, flexible and alkali-soluble photocurable compound, to provide a photocurable thermosetting resin composition having excellent adhesiveness, folding resistance, and heat resistance, and to provide a protecting film comprising the cured product of the photocurable thermosetting resin composition.
This photocurable compound (A) obtained by reacting a polybasic acid anhydride (d) with the reaction product of an epoxy compound (a) represented by the general formula 1 [M is H or a group of the formula 2; X and Y are each identically or differently a divalent aromatic group; (l) is 1 to 20] and having three or more epoxy groups in the molecule with an unsaturated monocarboxylic acid (b) and a saturated monocarboxylic acid (c). The alkali-developable photocurable thermosetting resin composition is characterized by comprising the photocurable compound (A), an epoxy compound having two or more epoxy groups in the molecule (B), a photopolymerization initiator (C), and a diluent (E).
KOYAMA TOMOHITO
TAKAYANAGI TAKASHI
