Title:
光硬化性ダイシングダイ接合テープ
Document Type and Number:
Japanese Patent JP5865391
Kind Code:
B2
Abstract:
A pressure sensitive adhesive comprising (A) pressure sensitive adhesive polymers having pendant carbon-carbon unsaturation and (B) hydrophobic polymers terminated with carbon-carbon unsaturation. In one embodiment the hydrophobic polymers are vinyl terminated polydimethoxyl siloxane polymers and/or vinyl terminated fluoropolymers reduces the interaction of the pressure sensitive adhesive with adherends and provides excellent release of the pressure sensitive adhesive after cure.
Inventors:
Lee, Byung Chun
Cian, Pauline
Becker, Kevin Harris
Cian, Pauline
Becker, Kevin Harris
Application Number:
JP2013546243A
Publication Date:
February 17, 2016
Filing Date:
December 16, 2011
Export Citation:
Assignee:
Henkel AG & Co. KGaA
International Classes:
C09J123/04; C09J11/06; C09J127/12; C09J175/04; C09J183/07
Domestic Patent References:
| JP2010163518A | ||||
| JP2008001817A | ||||
| JP2005277297A | ||||
| JP2008162240A |
Foreign References:
| WO2009050785A1 | ||||
| WO2009144985A1 |
Attorney, Agent or Firm:
Katsuhiro Ito
Akiko Ono
Akiko Ono