To provide a photo-curable resin composition capable of forming a pattern and also having a function as an adhesive that performs thermo compression bonding of substrates to each other and an adhesive using the same.
The photo-curable resin composition contains a polyimide silicone having a primary alcoholic hydroxyl group, as a component (A); at least one compound selected from the group consisting of an amino condensation product modified with formalin or a formalin-alcohol and a phenol compound having two or more in average of methylol group or alkoxymethylol group in one molecule thereof, as a component (B); a photo-acid generator as a component (C); and a multifunctional epoxy compound as a component (D).
COPYRIGHT: (C)2011,JPO&INPIT
Michihiro Sugo
Hideto Kato
Kazunori Kondo
Shohei Tagami
| JP2006133757A | ||||
| JP2009244628A | ||||
| JP2005043883A | ||||
| JP2002169286A |
Hironori Honda
Toshimitsu Ichikawa