Title:
PHOTOCURABLE RESIN COMPOSITION, PHOTOCURABLE THREE-DIMENSIONAL MOLDED PRODUCT, AND KIT FOR MANUFACTURING PHOTOCURABLE THREE-DIMENSIONAL MOLDED PRODUCT
Document Type and Number:
Japanese Patent JP2022008773
Kind Code:
A
Abstract:
To provide a new photocurable resin composition which can be cured in a large scale (large amount) in a short time through one step or through a small number of steps, and to provide a photocurable three-dimensional molded product and the like which uses the same and can maintain a designed shape even after being taken out from a container, a mold, or the like.SOLUTION: A photocurable resin composition for molding a photocurable three-dimensional molded product comprises the following (A) and (B), in which at least one of urethane bonds in (A) is derived from an isocyanate compound having three or more isocyanate groups in one molecule. The photocurable three-dimensional molded product using the same can maintain a designed shape even after being taken out from a container, a mold, or the like: (A) urethane (meth)acrylate, (B): photopolymerization initiator.SELECTED DRAWING: None
Inventors:
NAKATANI MIWAKO
HASUIKE NAOKO
SAKURAI TAIICHI
HASUIKE NAOKO
SAKURAI TAIICHI
Application Number:
JP2020111009A
Publication Date:
January 14, 2022
Filing Date:
June 28, 2020
Export Citation:
Assignee:
KSM KK
International Classes:
B29C64/264; B29C64/106; B33Y70/00; B33Y80/00; C08F290/06; C08G18/42; C08G18/48; C08G18/67; C08G18/79
Attorney, Agent or Firm:
Tomoko Yoshida
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