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Patent Searching and Data


Title:
PHOTOCURABLE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2005076018
Kind Code:
A
Abstract:

To provide a photocurable resin composition having good surface curability and high adhesive strength.

This photocurable resin composition contains a component (a) comprising a compound having two or more allyl groups (-CH2-CH=CH2) in its molecule, a component (b) comprising a compound having two or more mercapto groups (-SH) in its molecule, a component (c) comprising a compound having two or more (meth)acryloyl groups in its molecule, and a component (d) comprising a photopolymerization initiator as essential components, wherein a cured product obtained therefrom has a glass transition temperature of ≥ 35°C.


Inventors:
YODA KIMIHIKO
GOTO KEIJI
Application Number:
JP2003312085A
Publication Date:
March 24, 2005
Filing Date:
September 04, 2003
Export Citation:
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Assignee:
DENKI KAGAKU KOGYO KK
International Classes:
C08F2/38; C08F18/16; C08F20/20; C08F20/36; C08F26/06; C09J4/00; C09J11/00; (IPC1-7): C08F18/16; C08F2/38; C08F20/20; C08F20/36; C08F26/06; C09J4/00; C09J11/00