Title:
PHOTOCURABLE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2011225886
Kind Code:
A
Abstract:
To provide a photocationic-curable resin composition having excellent polymerization rate at low temperatures, and giving its cured product which exhibits excellent adhesive strength and moisture permeation resistance and has high productivity.
The photocationic-curable resin composition comprises (A) a cationic-polymerizable compound which is an epoxy group-containing compound and/or oxetane ring-containing compound, (B) a photocationic initiator, and (C) a specific aromatic ether compound.
Inventors:
TAKAMATSU YASUSHI
YAMAMOTO YUGO
IMON SHUHEI
MIZUTA YASUSHI
KIKUTA YOSHIO
KUWAZUKA TOSHIAKI
YAMAMOTO YUGO
IMON SHUHEI
MIZUTA YASUSHI
KIKUTA YOSHIO
KUWAZUKA TOSHIAKI
Application Number:
JP2011126397A
Publication Date:
November 10, 2011
Filing Date:
June 06, 2011
Export Citation:
Assignee:
MITSUI CHEMICALS INC
International Classes:
C08G59/68; C08G65/18; G02F1/1339; H01L51/50; H05B33/04
Domestic Patent References:
| JP2001139933A | 2001-05-22 | |||
| JP2001002760A | 2001-01-09 |
Attorney, Agent or Firm:
Patent corporation ssinpat