Title:
PHOTOCURABLE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2016089084
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a photocurable resin composition that can be cured by irradiation with light even when the composition is applied, for example, as a liquid crystal sealing agent used in a one-drop-fill process, to an adhesion target having a light-shielding part, and a method for sealing a light-shielding part by using the above photocurable resin composition.SOLUTION: The photocurable resin composition comprises a curable compound (component A), a photosensitizer (component B) and a compound (component C) represented by formula (1).SELECTED DRAWING: None
More Like This:
Inventors:
ISHIDA HISAKI
SHIRAHAMA YOSHIHARU
SHIRAHAMA YOSHIHARU
Application Number:
JP2014226830A
Publication Date:
May 23, 2016
Filing Date:
November 07, 2014
Export Citation:
Assignee:
KYORITSU KAGAKU SANGYO
International Classes:
C08G85/00; C08F2/44; C08F2/50; C08K5/29; C08L101/00; C09K3/10; G02F1/1339
Domestic Patent References:
JP2004361854A | 2004-12-24 | |||
JP2005292801A | 2005-10-20 | |||
JP2012167271A | 2012-09-06 | |||
JP2015127356A | 2015-07-09 | |||
JP2015232605A | 2015-12-24 |
Foreign References:
WO2015111640A1 | 2015-07-30 | |||
WO2014208632A1 | 2014-12-31 | |||
US7714037B1 | 2010-05-11 |
Attorney, Agent or Firm:
Daisuke Shiba
Previous Patent: METHOD FOR PRODUCING GAS BARRIER FILM, GAS BARRIER FILM AND ELECTRONIC DEVICE
Next Patent: COMPOSITION
Next Patent: COMPOSITION