PURPOSE: To obtain the subject composition containing a specific resin, a specific diacrylate and a specific photopolymerization initiator as essential components, excellent in flexibility, heat resistance and alkali resistance, and useful in an electronic material field.

CONSTITUTION: A photocurable resin composition contains (A) a vinylester resin of formula I (R1 is H, methyl; R2 is a divalent organic group; n is 0, 1) (e.g. a resin of formula II), (B) a tricyclodecanedimethylol diacrylate of formula III (R3 is H, methyl) (e.g. a compound of formula IV), and (C) a photopolymrization initiator (e.g. biacetylacetophenone) as essential components. The components A, B and C are preferably used in amounts of 95-5 pts.wt., 5-95 pts.wt., and 3-15 pts.wt. (based on 100 pts.wt. of the total amount of the components A and B), respectively.