Title:
PHOTOCURABLE RESIN PASTE COMPOSITION
Document Type and Number:
Japanese Patent JP2005255851
Kind Code:
A
Abstract:
To provide a photocurable resin paste composition which shows little change in viscosity with time and can be used stably.
The photocurable resin paste composition, which is used for optical molding, comprises a nonionic photocurable resin and an inorganic powder and/or a metal powder.
Inventors:
HIOKI TAISUKE
NAKAMURA ICHIRO
NAKAMURA ICHIRO
Application Number:
JP2004069381A
Publication Date:
September 22, 2005
Filing Date:
March 11, 2004
Export Citation:
Assignee:
MURATA MANUFACTURING CO
International Classes:
C08F2/44; C08F20/00; (IPC1-7): C08F20/00; C08F2/44
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