PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION, PHOTOCURABLE AND THERMOSETTING LAYER, INK, ADHESIVE, AND PRINTED CIRCUIT BOARD

Japanese Patent JP2010006949

A

To use a photocurable and thermosetting resin composition for providing ink and an adhesive, automobile components using them, and a printed circuit board and the like used for electric appliances and the like.

The photocurable and thermosetting resin composition comprises a modified polyester resin D obtained by reacting a residual carboxy group in a polyester resin C containing a soft segment and a hard segment with a (meth)acrylic monomer; a (meth)acrylic monomer and/or an allyl group-containing monomer E; and an epoxy resin F. In the main chain of the modified polyester resin D, a part of the residual carboxy groups remains, while an ethylenically unsaturated double bond is included in the side chain of the modified polyester resin D. Based on 100 pts.wt. of the modified polyester resin D, a content of the (meth)acrylic monomer and/or the allyl group-containing monomer E is 5-30 pts.wt, and a content of the epoxy resin F is 5-50 pts.wt.

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HOTTA YASUNARI
OGI KOJI
KAWAKUSU TETSUO

JP2008167649A

January 14, 2010

June 26, 2008

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TOYO BOSEKI

C08F290/14; C08F230/02; C08G59/42; C08G63/692; C08G63/91; C09D11/00; C09J4/02; C09J155/00; C09J167/00; C09J167/02; C09J167/06; H05K3/28

Patent Business Corporation Unias International Patent Office

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