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Title:
光検出器
Document Type and Number:
Japanese Patent JP5259430
Kind Code:
B2
Abstract:
In an infrared sensor (1) having a bolometer element (11) and a reference element (21), the reference element (21) comprises a bolometer film (22), a substrate-side insulating film (31) formed on the substrate-side surface of the bolometer film (22), a heat dissipation film (23) made of amorphous silicon formed on the substrate-side surface of the bolometer film (22) with the substrate-side insulating film (31) interposed therebetween, and a plurality of heat dissipation columns (25) made of amorphous silicon thermally connected to the heat dissipation film (23) and a substrate (10), while the bolometer film (22) and substrate-side insulating film (31) are formed such as to extend over a side face of the heat dissipation film (23) intersecting a surface of the substrate (10). Thus configured infrared sensor (1) can efficiently reduce the influence of temperature changes in the environment in use, while being made smaller.

Inventors:
Suzuki Jun
Fumiichi Ojima
Ryusuke Kitaura
Application Number:
JP2009000926A
Publication Date:
August 07, 2013
Filing Date:
January 06, 2009
Export Citation:
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Assignee:
Hamamatsu Photonics Co., Ltd.
International Classes:
G01J1/02; G01J1/42; H01L27/144; H01L31/0248; H01L37/00
Domestic Patent References:
JP10209418A
JP2001099705A
JP4274346A
JP2005043381A
JP2008022315A
JP10185681A
JP2002533668A
JP2008219613A
Foreign References:
WO2009116496A1
Attorney, Agent or Firm:
Yoshiki Hasegawa
Shiro Terasaki
Satoru Ishida
Kenichi Shibayama



 
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